31.080 : Semiconductor devices

31.080.01

Semiconductor devices in general

31.080.10

Diodes

31.080.20

Thyristors

31.080.30

Transistors

31.080.99

Other semiconductor devices
DIN EN 60749-19:2003-10

DIN EN 60749-19:2003-10

Superseded Historical

Semiconductor devices - Mechanical and climatic test methods - Part 19: Die shear strength (IEC 60749-19:2003); German version EN 60749-19:2003 + Corrigendum 2003-06.

€41.78

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DIN EN 60749-15:2003-10

DIN EN 60749-15:2003-10

Superseded Historical

Semiconductor devices - Mechanical and climatic test methods - Part 15: Resistance to soldering temperature for through-hole mounted devices (IEC 60749-15:2003); German version EN 60749-15:2003.

€56.17

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DIN EN 60749-20:2003-12

DIN EN 60749-20:2003-12

Superseded Historical

Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic-encapsulated SMDs to the combined effect of moisture and soldering heat (IEC 60749-20:2002 + Corr. 1:2003); German version EN 60749-20:2003.

€98.32

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DIN EN 60749-32:2003-12

DIN EN 60749-32:2003-12

Superseded Historical

Semiconductor devices - Mechanical and climatic test methods - Part 32: Flammability of plastic-encapsulated devices (externally induced) (IEC 60749-32:2003 + Corr. 1:2003); German version EN 60749-32:2003 + Corr.:2003.

€41.78

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DIN IEC 62047-1:2003-10

DIN IEC 62047-1:2003-10

Superseded Historical

Semiconductor devices - Part 1: Microelectromechanical devices; Terms and definitions (IEC 47/1695A/CD:2003)

€98.32

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DIN IEC 60747-1:2004-06

DIN IEC 60747-1:2004-06

Withdrawn Most Recent

Semiconductor devices - Part 1: General (IEC 47/1734/CD:2003)

€122.34

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DIN EN 60749-29:2004-07

DIN EN 60749-29:2004-07

Superseded Historical

Semiconductor devices - Mechanical and climatic test methods - Part 29: Latch-up test (IEC 60749-29:2003); German version EN 60749-29:2003 + Corrigendum:2004.

€98.32

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DIN IEC 62047-2:2004-08

DIN IEC 62047-2:2004-08

Superseded Historical

Microelectromechanical devices - Part 2: Tensile testing method of thin film materials (IEC 47/1759/CD:2004)

€69.91

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DIN IEC 62047-3:2004-08

DIN IEC 62047-3:2004-08

Superseded Historical

Microelectromechanical devices - Part 3: Thin film standard test piece (IEC 47/1760/CD:2004)

€41.78

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DIN EN 60749-34:2004-10

DIN EN 60749-34:2004-10

Superseded Historical

Semiconductor devices - Mechanical and climatic test methods - Part 34: Power cycling (IEC 60749-34:2004); German version EN 60749-34:2004.

€69.91

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DIN IEC 60747-9:2004-09

DIN IEC 60747-9:2004-09

Withdrawn Most Recent

Semiconductor devices - Discrete devices - Part 9: Insulated gate bipolar transistors (IGBTs) (IEC 47E/258/CD:2004)

€167.66

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DIN IEC 62373:2004-09

DIN IEC 62373:2004-09

Superseded Historical

Bias-Temperature Stability Test for MOSFET (IEC 47/1763/CD:2004)

€91.03

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DIN IEC 62374:2004-09

DIN IEC 62374:2004-09

Superseded Historical

Time Dependent Dielectric Breakdown Test (TDDB) (IEC 47/1764/CD:2004)

€91.03

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DIN IEC 60747-16-1/A1:2004-11

DIN IEC 60747-16-1/A1:2004-11

Superseded Historical

Semiconductor devices - Discrete devices - Part 16-1: Microwave integrated circuits - Amplifiers (IEC 47E/264/CD:2004)

€98.32

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DIN IEC 60749-35:2004-12

DIN IEC 60749-35:2004-12

Superseded Historical

Semiconductor devices - Mechanical and climatic test methods - Part 35: Acoustic microscopy for non-hermetic encapsulated electronic components (IEC 47/1769/CD:2004)

€98.32

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