31.190 : Electronic component assemblies

IEC 60068-2-69:2017/COR1:2018

IEC 60068-2-69:2017/COR1:2018

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IEC 60068-2-69:2017/COR1:2018 Corrigendum 1 - Environmental testing - Part 2-69: Tests - Test Te/Tc: Solderability testing of electronic components and printed boards by the wetting balance (force measurement)

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IEC 61760-4:2015/AMD1:2018

IEC 61760-4:2015/AMD1:2018

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IEC 61760-4:2015/AMD1:2018 Amendment 1 - Surface mounting technology - Part 4: Classification, packaging, labelling and handling of moisture sensitive devices

€12.00

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IEC 60068-2-69:2017/AMD1:2019

IEC 60068-2-69:2017/AMD1:2019

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IEC 60068-2-69:2017/AMD1:2019 Amendment 1 - Environmental testing - Part 2-69: Tests - Test Te/Tc: Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method

€23.00

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IEC 61760-3:2021

IEC 61760-3:2021

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IEC 61760-3:2021 Surface mounting technology - Part 3: Standard method for the specification of components for through-hole reflow (THR) soldering

€244.00

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IEC 60194-1:2021

IEC 60194-1:2021

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IEC 60194-1:2021 Printed boards design, manufacture and assembly - Vocabulary - Part 1: Common usage in printed board and electronic assembly technologies

€551.00

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IEC 61188-6-2:2021

IEC 61188-6-2:2021

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IEC 61188-6-2:2021 Circuit boards and circuit board assemblies - Design and use - Part 6-2: Land pattern design - Description of land pattern for the most common surface mounted components (SMD)

€186.00

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IEC 61188-6-1:2021

IEC 61188-6-1:2021

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IEC 61188-6-1:2021 Circuit boards and circuit board assemblies - Design and use - Part 6-1: Land pattern design - Generic requirements for land pattern on circuit boards

€302.00

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IEC 62878-2-602:2021

IEC 62878-2-602:2021

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IEC 62878-2-602:2021 Device embedding assembly technology - Part 2-602: Guideline for stacked electronic module - Evaluation method of inter-module electrical connectivity

€93.00

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IEC 60068-2-21:2021

IEC 60068-2-21:2021

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IEC 60068-2-21:2021 Environmental testing - Part 2-21: Tests - Test U: Robustness of terminations and integral mounting devices

€342.00

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IEC 63215-2:2023

IEC 63215-2:2023

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IEC 63215-2:2023 Endurance test methods for die attach materials - Part 2: Temperature cycling test method for die attach materials applied to discrete type power electronic devices

€186.00

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IEEE 91/91a:1984 (R1994)

IEEE 91/91a:1984 (R1994)

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IEEE Standard Graphic Symbols for Logic Functions (Including and incorporating IEEE Std 91a-1991, Supplement to IEEE Standard Graphic Symbols for Logic Functions)

€216.00

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IEEE/ANSI 91/91a:1991 (R1994)

IEEE/ANSI 91/91a:1991 (R1994)

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IEEE Standard Graphic Symbols for Logic Functions (Including and incorporating IEEE Std 91a-1991, Supplement to IEEE Standard Graphic Symbols for Logic Functions)

€237.00

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IEEE 1101.3:1993

IEEE 1101.3:1993

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IEEE Mechanical Standard for Conduction-Cooled and Air-Cooled 10 SU Modules

€146.00

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IEEE 1101.4:1993

IEEE 1101.4:1993

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IEEE Standard for Military Module, Format E Form Factor

€146.00

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IEEE 370:2020

IEEE 370:2020

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IEEE Standard for Electrical Characterization of Printed Circuit Board and Related Interconnects at Frequencies up to 50 GHz

€156.00

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