IEC 61188-6-3:2024 Circuit boards and circuit board assemblies - Design and use - Part 6-3: Land pattern design - Description of land pattern for through hole components (THT)
€302.00
Circuit boards and circuit board assemblies. Design use Land pattern design. Description of land for through hole components (THT)
€329.00
IEC 61191-1:2018 Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies
€342.00
Assurance produit des projets spatiaux - Soudure haute fiabilité pour les connexions électriques à montage en surface, à technologie combinée et montées à la main
€230.00
BS EN IEC 61869-3 Instrument transformers Additional requirements for inductive voltage
€24.00
Techniques d'assemblage avec appareil(s) intégré(s) - Partie 2-602 : lignes directrices pour un empilement de modules électroniques - Méthode d'évaluation de la connectivité électrique entre modules
€93.33
BS EN IEC 61760-4 Surface mounting technology Part 4: Classification, packaging, labelling and handling of moisture sensitive devices ED2
Draft BS EN 61249-2-55 Materials for printed boards and other interconnecting structures Part 2-55. Reinforced base materials clad unclad. Non-halogenated modified or unmodified resin system, woven E-glass laminate sheets of defined dissipation factor (less than 0,005 at 10 GHz) flammability (vertical burning test), copper-clad
Draft BS EN IEC 61191-10-2 ED1 Circuit board assemblies Part 10-2 : Guideline for the Output Profile Design in Laser-Assisted Bonding
Draft BS EN 63609-1 Measurement method used in thermal design for electronics assemblies Part 1: requirements the circuit boards or with miniaturized SMDs where heat dissipation path to board is dominant
Draft BS EN 63609-2 Measurement method used in thermal design for electronics assemblies Part 2: conductivity of circuit boards with polymer composites
Environmental testing - Part 2-69: Tests - Test Te: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method
€76.00
Surface mounting technology - Part 3 : Standard method for the specification of components for through hole reflow (THR) soldering
€123.00
Printed boards and printed board assemblies - Design and use - Part 6-2 : land pattern design - Description of land pattern for the most common surface mounted components (SMD) - Cartes à circuit imprimé et cartes à circuit imprimé équipées - Conception et utilisation - Partie 6-2 : conception de la zone de report - Description de la zone de report pour les composants montés en surface (CMS) les plus courants
€109.00
IEC TR 62878-2-2:2015 Device embedded substrate - Part 2-2: Guidelines - Electrical testing
€93.00
