Semiconductor devices - Generic semiconductor qualification guidelines - Part 1: Guidelines for LSI reliability qualification (IEC 47/2614/CDV:2020); German and English version prEN IEC 63287-1:2020
€150.65
Semiconductor devices - Part 16-6: Microwave integrated circuits - Frequency multipliers (IEC 60747-16-6:2019); German version EN IEC 60747-16-6:2019
€116.64
Semiconductor devices - Part 16-7: Microwave integrated circuits - Attenuators (IEC 47E/734/CD:2020); Text in English
€128.22
Semiconductor devices - Part 16-8: Microwave integrated circuits - Limiters (IEC 47E/735/CD:2020); Text in English
€122.34
Semiconductor devices - Part 16-5: Microwave integrated circuits - Oscillators (IEC 60747-16-5:2013 + A1:2020 + COR1:2020); German version EN 60747-16-5:2013 + A1:2020.
€140.00
Semiconductor devices - Mechanical and climatic test methods - Part 15: Resistance to soldering temperature for through-hole mounted devices (IEC 60749-15:2020); German version EN IEC 60749-15:2020.
€77.20
Semiconductor devices - Guidelines for reliability qualification plans - Part 2: Concept of mission profile (IEC 47/2718/CDV:2021); German and English version prEN IEC 63287-2:2021
€98.32
Semiconductor devices - Part 16-9: Microwave integrated circuits - Phase shifters (IEC 47E/768/CD:2021); Text in German and English
Dynamic on-resistance test method guidelines for GaN HEMT based power conversion devices (IEC 63373:2022); German version EN IEC 63373:2022
€91.03
Semiconductor devices - Mechanical and climatic test methods - Part 41: Standard reliability testing methods of non-volatile memory devices (IEC 60749-41:2020); German version EN IEC 60749-41:2020
€111.40
Semiconductor devices - Mechanical and climatic test methods - Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing (IEC 60749-30:2020); German version EN IEC 60749-30:2020.
Semiconductor devices - Mechanical and climatic test methods - Part 37: Board level drop test method using an accelerometer (IEC 47/2651/CDV:2020); German and English version prEN IEC 60749-37:2020
Wearable electronic devices and technologies - Part 402-3: Performance measurement method of wearables - Series 2: Accuracy of Heart Rate Determination (IEC 124/167/CD:2021); Text in German and English
Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat (IEC 60749-20:2020); German version EN IEC 60749-20:2020.
